RFID tag maker Texas Instruments (TI) and Smurfit-Stone Container Corp., a Chicago-based manufacturer of cardboard and packaging products, have jointly developed a packaging model that uses RFID tags on packaging boxes. Sign." This model integrates an RFID tag inlay directly into the corrugated cardboard box. The tag antenna is printed directly onto the box with conductive ink. The antenna is sealed with an RFID tag with a conductive strap. Corrugated cardboard box is divided into three layers: an inner wall layer (noodle board), middle wave layer and outer wall layer (noodle board). The tag inlay embedded between the inner wall layer and the corrugated layer is well protected.
This butterfly-shaped RFID strap consists of an integrated circuit and two conductive pads. The company predicts that this type of integration of RFID tag inlays into packaging materials will save labor costs and material costs for consumer packaging companies in the future, as this model does not require the purchase of separate package tags.
"This kind of box is a future product, a bit like a concept car," said Joseph LeBlanc, vice president of research and development at Smurfit-Stone. "The mass production of this product requires a lot of demand, compared to existing smart tags." The demand is even greater." However, he believes that the proof of this concept is an important one. Compared with the production of finished RFID tags, this type of RFID tag has less production materials and fewer production steps, making it possible to produce large amounts of low-cost production.
"We have been developing samples of this type of RFID integration tape for 18 months," said Tony Sabetti, director of the UHF/retail supply chain at TI-RFiD. "This is the first RFID RFID antenna printed directly on the packaging material. Take samples."
Sabetti said that the latest developments in the quality and concentration of conductive inks have greatly improved the readability of bare tags in packaging boxes. He added that the tape could be produced by the labeling method or the labeling process of the TI-RFiD/Smurfit-Ston RFID box, and the antenna would be printed on the label inlay, and the tape would then be sealed. Placing an antenna on an IC chip does not need to be performed in a clean room now. It is for this reason that some label packagers are interested in TI's label tape.
LeBlanc said that although the current requirements for RFID integrated packaging are still low, Smurfit-Stone has already done a preliminary model development because they believe that as more items are requested for labeling, consumer packaging companies will eventually adopt this integration. Tag mode.
Source of information: pack.cn
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